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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Dual Bus Driver/Receiver with 4-to-1 Output Multiplexers
The MC10H332 is a Dual Bus Driver/Receiver with four-to-one output multiplexers. These multiplexers have common selects and output enable. When disabled, (OE = high) the bus outputs go to -2.0 V. The parameters specified are with 25 loading on the bus drivers and 50 loads on the receivers. * Propagation Delay, 1.5 ns Typical Data-to-Output * Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) * Voltage Compensated * MECL 10K-Compatible
MC10H332
L SUFFIX CERAMIC PACKAGE CASE 732-03 P SUFFIX PLASTIC PACKAGE CASE 738-03 FN SUFFIX PLCC CASE 775-02
MAXIMUM RATINGS
Characteristic Power Supply (VCC = 0) Input Voltage (VCC = 0) Output Current -- Continuous -- Surge Operating Temperature Range Storage Temperature Range -- Plastic -- Ceramic Symbol VEE VI Iout TA Tstg Rating -8.0 to 0 0 to VEE 50 100 0 to +75 -55 to +150 -55 to +165 Unit Vdc Vdc mA C C C VCC XBUS X0 X1 X2 X3 Max 115 Unit mA A -- -- -- IinL VOH VOL VIH VIL tpd 0.8 0.8 0.8 0.8 1.8 0.8 1.3 tr tf 0.5 0.5 3.0 3.4 2.4 2.1 4.5 2.2 4.0 2.0 2.0 0.8 0.8 0.8 0.8 1.8 0.8 1.3 0.5 0.5 3.0 3.4 2.4 2.1 4.5 2.2 4.0 2.0 2.0 0.8 0.8 0.8 0.8 1.8 0.8 1.3 0.5 0.5 3.2 3.8 2.6 2.4 5.0 2.5 4.5 2.1 2.1 ns ns 0.5 667 437 456 -- -- -- -- 0.5 417 273 285 -- -- -- -- 0.3 417 273 285 -- -0.735 -1.60 -0.735 -1.45 A Vdc Vdc Vdc Vdc
NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Receiver outputs are terminated through a 50-ohm resistor to -2.0 volts dc. Bus outputs are terminated through a 25-ohm resistor to -2.0 volts dc.
DIP & PLCC PIN ASSIGNMENT
1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VCC02 YBUS OE Y0 Y1 Y2 Y3 RE YIN VCC01
ELECTRICAL CHARACTERISTICS (VEE = -5.2 V 5%) (See Note)
0 Characteristic Power Supply Current Input Current High Pins 3,4,5,6,14, 15,16,17 Pins 7,8 Pins 13, 18 Input Current Low High Output Voltage Low Output Voltage High Input Voltage Low Input Voltage Symbol IE IinH Min -- Max 115 Min -- 25 Max 110 Min -- 75
S0 S1 XIN VEE
-1.02 -0.84 -0.98 -0.81 -0.92 -1.95 -1.63 -1.95 -1.63 -1.95 -1.17 -0.84 -1.13 -0.81 -1.07 -1.95 -1.48 -1.95 -1.48 -1.95
Pin assignment is for Dual-in-Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6-11 of the Motorola MECL Data Book (DL122/D).
AC PARAMETERS
Propagation Delay Data-to-Bus Output Select-to-Bus Output OE-to-Bus Output Bus-to-Receiver Select-to-Receiver RE-to-Receiver Data-to-Receiver Rise Time Fall Time
3/93
ns
(c) Motorola, Inc. 1996
2-13
REV 5
MC10H332
MULTIPLEXER TRUTH TABLE
OE H L L L L S1 X L L H H S0 X L H L H XBus -2.0V X0 X1 X2 X3 YBus -2.0V Y0 Y1 Y2 Y3
RECEIVER TRUTH TABLE
RE H L Xin L XBus Yin L YBus
LOGIC DIAGRAM
OE X0 X1 X2 X3 S0 S1 Y0 Y1 Y2 Y3 XIN RE YIN 18 3 4 5 6 7 8 17 16 15 14 9 13 12 VCC VCC01 VCC02 VEE = = = = PIN 1 PIN 11 PIN 20 PIN 10 19 YBUS 2 XBUS
MOTOROLA
2-14
MECL Data DL122 -- Rev 6
MC10H332
OUTLINE DIMENSIONS
FN SUFFIX PLASTIC PLCC PACKAGE CASE 775-02 ISSUE C
B -N- Y BRK D -L- -M- W D Z
0.007 (0.180) M T L-M U
S
N
S S
0.007 (0.180) M T L-M
N
S
20
1
X V VIEW D-D
G1
0.010 (0.250)
S
T L-M
S
N
S
A Z R
0.007 (0.180) M T L-M 0.007 (0.180) M T L-M
S
N N
S
S
S
H
0.007 (0.180) M T L-M
S
N
S
C
E 0.004 (0.100) G G1 0.010 (0.250) S T L-M J -T-
SEATING PLANE
K1 K F VIEW S 0.007 (0.180)
M
VIEW S
S
T L-M
S
N
S
N
S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10 _ 0.310 0.330 0.040 ---
MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10 _ 7.88 8.38 1.02 ---
MECL Data DL122 -- Rev 6
2-15
MOTOROLA
MC10H332
OUTLINE DIMENSIONS
L SUFFIX CERAMIC DIP PACKAGE CASE 732-03 ISSUE E
20 1
11 10
NOTES: 1. LEADS WITHIN 0.010 DIAMETER, TRUE POSITION AT SEATING PLANE, AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONS A AND B INCLUDE MENISCUS. INCHES MIN MAX 0.940 0.990 0.260 0.295 0.150 0.200 0.015 0.022 0.055 0.065 0.100 BSC 0.020 0.050 0.008 0.012 0.125 0.160 0.300 BSC 0_ 15_ 0.010 0.040
B A F C L
DIM A B C D F G H J K L M N
N H D
SEATING PLANE
G
K
J M
-A-
20 11
P SUFFIX PLASTIC DIP PACKAGE CASE 738-03 ISSUE E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01
B
1 10
C
L
-T-
SEATING PLANE
K M E G F D
20 PL
N J 0.25 (0.010)
M 20 PL
0.25 (0.010) TA
M
M
TB
M
DIM A B C D E F G J K L M N
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JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 81-3-3521-8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
MOTOROLA 2-16
MC10H332/D MECL Data DL122 -- Rev 6

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